In order to reduce production costs and improve production efficiency, in view of resource environmental protection.
Number of pins: 6L/7L/8L/9L/10L/12L/14L/16L/18L/20L/24L/28L
Product arrangement: 1R/2R/3R/4R/5R
Raw materials: NI 42/A194/C7025/SPCC/KFC
Product thickness: 0.127/0.152/0.203/0.254
Product description: the pure copper wire of the company can be divided into copper wire and ultrasoft copper wire according to flexility, respectively expressed via KC1 and Ultra soft. Due to low hardness, ultrasoft copper wire can make the bonding window wider, and at the same time reduce pad aluminum extrusion and can enhance the tension of second welding point. It has very good binding ability on some thinner-aluminum coating products.
Product use: mainly used for semiconductor encapsulation, e.g., QFN DFN SO and other some integrated circuit package.
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