Gold plating palladium line
In order to reduce production costs and improve production efficiency, in view of resource environmental protection.
Number of pins: 6L/7L/8L/9L/10L/12L/14L/16L/18L/20L/24L/28L
Product arrangement: 1R/2R/3R/4R/5R
Raw materials: NI 42/A194/C7025/SPCC/KFC
Product thickness: 0.127/0.152/0.203/0.254
Product description: for such product, the surface of pure copper wire is plated palladium and gold via the way of electroplating and chemical plating to make it having good oxidation resistance, capable of improving the stability of bonding operation and enhancing the tension of second welding point.
Product use: mainly used for semiconductor encapsulation, e.g., QFN DFN SO and other some integrated circuit package.
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